Job Description
## Director, Manufacturing EngineeringSanand, Gujarat, IndiaThe Director of Manufacturing Engineering will lead the engineering organization responsible for semiconductor backend assembly processes, including backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI and related technologies. The role oversees process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. The director will be a key player in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing operations to hit quality output target while reaching BIC (best in class) engineering KPI.• 20+ years of experience in semiconductor backend manufacturing with deep expertise in assembly engineering.• At least 10 years in a senior engineering management role.• Proven experience in deploying new technologies, scaling NPI, and driving process/yield improvement in high-volume manufacturing.• Strong knowledge of backend assembly processes (backgrinder, laser dicer, wire bond, die attach, molding, flipchip, AOI etc.).• Experience with advanced packaging technologies is a strong plus.• Familiarity with semiconductor packaging equipment and automation (ASM, DISCO, Kulicke & Soffa, TOWA etc.).We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life *for all*. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
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