SMT Line Packaging Engineer

Roles: ISP Packaging Lead - OSAT Semiconductor

Experience: 10-15 Yrs

Education Qualification: Bachelor's/Master's in Mechanical, Electrical, or Electronics Engineering

Job Description

- Experience in semiconductor packaging with hands-on experience in SMT and TLA line management - Oversee SMT and TLA line operations at OSAT sites, ensuring process stability, yield, and throughput targets - Coordinate with materials, and test engineering teams to define packaging architecture and assembly flow - Drive process optimization, equipment selection, and line readiness for NPI and high-volume production - Manage DFM reviews, BOM validation, and package reliability qualification - Interface with OSAT vendors for process audits, issue resolution, and continuous improvement initiatives.